| 论文编号: | |||||||||
| 作者: | Wang, Cong; Li, Chuanqiang; Luo, Zhi; Li, Ming; Lin, Nai; Ding, Kaiwen; Man, Shu; Duan, Ji'an | ||||||||
| 刊物名称: | JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS | ||||||||
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| 论文题目: | Bonding strength enhancement by Ag-Zn-Cu intermetallic compounds and microscale tapers array fabricated by femtosecond laser | ||||||||
| 发表年度: | 2021 | ||||||||
| 卷: | 32 | ||||||||
| 期: | 14 | ||||||||
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